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Item #:
270813495
Semiconductor Advanced Packaging
Item #:
270813495
HKD 1067
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Product Details
- The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
| Publisher | Springer |
| Publication date | May 19, 2022 |
| Edition | 2021st |
| Language | English |
| Print length | 520 pages |
| ISBN-10 | 9811613788 |
| ISBN-13 | 978-9811613784 |
| Item Weight | 1.74 pounds (790 grams) |
| Dimensions | 6.1 x 1.18 x 9.25 inches (15.5 x 3 x 23.5 cm) |
Product Description
Semiconductor Advanced Packaging
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HKD 1067
Order now and get it around Sunday, October 18
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