Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
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Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Universal BGA reballing stencil offers four different pitch options for precise soldering, ensuring versatility and accuracy in BGA IC chip repair.
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
物品 #: 228106567

Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel

物品 #: 228106567

HKD 111

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現在訂購，約可在下列時間收貨： 星期四, 八月 06
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Universal BGA reballing stencil offers four different pitch options for precise soldering, ensuring versatility and accuracy in BGA IC chip repair.
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What Stands Out

Compact Design
This reballing stencil's compact size facilitates easy storage and portability, making it ideal for repair technicians who require efficiency without sacrificing functionality during mobile device repairs.
High-Quality Material
Crafted from durable stainless steel, this stencil ensures long-lasting use and precision, providing technicians with reliable tools that withstand repeated use for thorough and accurate component repairs.
Universal Compatibility
Designed for various phone IC chips, this stencil provides versatility in repairs, addressing a wide range of user needs and ensuring compatibility with most popular device models on the market.

產品詳情

Shop Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel online at a best price in 香港. B0GZVVW343
  • [FOUR PITCHES] Universal BGA reballing stencil offers four different pitch options for precise soldering, ensuring versatility and accuracy in BGA IC chip repair.
  • [PRECISE POSITIONING] Tin mesh solder template allows fast and precise tin implantation without shifting under high temperatures, making reballing effortless and efficient.
  • [COMPACT APPEARANCE] With a and compact design, the BGA reballing stencil is portable and easy to use, providing convenience without compromising on quality.
  • [VERSATILE USAGE] This stencil is suitable for a variety of common IC chips found in phones today, meeting all your reballing needs with its wide compatibility.
  • [DURABLE MATERIAL] Crafted from premium stainless steel, the tin mesh solder template boasts durability and longevity, ensuring reliable performance for long-term use.
BrandEminchu
Included Componentsno
Model NumberEminchu8g43mcizpy (2141.2 cm)
Part NumberEminchu8g43mcizpy (2141.2 cm)
Unit Count1.0 count
Country of OriginChina
ManufacturerEminchu
Item Weight1 lbs (450 grams)

Who Should Buy?

Suitable For
  • Mobile Repair Technicians

    Ideal for technicians specializing in mobile repairs, needing precise stencil tools for effective BGA reballing tasks.

  • DIY Electronics Enthusiasts

    Great for hobbyists looking to perform advanced repairs on smartphones, enhancing their skills with professional tools.

  • Small Repair Shops

    Perfect for small repair shops wanting compact and efficient reballing solutions to improve workflow and service quality.

Not Suitable For
  • Mass Production Facilities

    Not suitable for high-volume production environments requiring automation and large-scale reballing equipment.

  • Amateur Hobbyists

    Not recommended for beginners who may struggle with the precision required for effective BGA reballing without experience.

  • General Consumer Use

    Not for everyday consumers as it requires technical skills beyond basic user capabilities for effective application.

產品敘述

有疑問？ 與我們聊天

客戶問題＆回答

  • 題: What pitch options does the stencil offer?

    回答: The stencil offers four pitch options: 0.3mm, 0.35mm, 0.375mm, and 0.4mm.
  • 題: Is the stencil easy to transport?

    回答: Yes, the compact and elegant design makes it portable and easy to use.
  • 題: What materials is the stencil made from?

    回答: The stencil is made from premium stainless steel, ensuring durability and longevity.

Eminchu Templates Eminchu8g43mcizpy (2141.2 cm) Editorial Review

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HKD 111

現在訂購，約可在下列時間收貨： 星期四, 八月 06

QTY:

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PCI DSS compliant and ISO 27001:2022 certified, with encrypted payments and full buyer protection on every order.

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  • fedex
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Fastest cross-border delivery

特色和優勢

  • Four pitch options for versatile and accurate soldering.
  • Fast and precise tin implantation without displacement.
  • Elegant, compact, and portable design for easy use.
  • Compatible with a variety of common IC chips.
  • Crafted from durable stainless steel for long-term reliability.
  • Ideal for efficient BGA IC chip repair.

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Experience worry-free shopping with 100% original products, PCI DSS-compliant payment security, ISO 27001-certified data protection, the fastest cross-border delivery, free returns *, and secure packaging on every order.